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d a t a sh eet product speci?cation supersedes data of 1998 oct 16 file under integrated circuits, ic01 2000 mar 08 integrated circuits tda1519c 22 w btl or 2 11 w stereo power amplifier
2000 mar 08 2 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c features requires very few external components for bridge-tied load (btl) stereo or btl application high output power low offset voltage at output (important for btl) fixed gain good ripple rejection mute/standby switch load dump protection ac and dc short-circuit-safe to ground and v p thermally protected reverse polarity safe capability to handle high energy on outputs (v p =0v) no switch-on/switch-off plop protected against electrostatic discharge low thermal resistance identical inputs (inverting and non-inverting) pin compatible with tda1519b (tda1519c and TDA1519CSP). general description the tda1519c is an integrated class-b dual output amplifier in a 9-lead plastic single in-line (sil) power or 20-lead heatsink small outline package. for the tda1519cth (sot418-2) the heatsink is positioned on top of the package, thereby allowing an external heatsink to be mounted on top. the heatsink of the tda1519ctd (sot397-1) is facing the pcb thereby allowing the heatsink to be soldered on the copper area of the pcb. ordering information type number package name description version tda1519c sil9p plastic single in-line power package; 9 leads sot131-2 TDA1519CSP sms9p plastic surface mounted single in-line power package; 9 leads sot354-1 tda1519cth hsop20 heatsink small outline package; 20 leads; low stand-off sot418-2 tda1519ctd hsop20 heatsink small outline package; 20 leads sot397-1
2000 mar 08 3 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c quick reference data symbol parameter conditions min. typ. max. unit supplies v p supply voltage operating 6.0 14.4 17.5 v non-operating -- 30 v load dump protected -- 45 v i orm repetitive peak output current -- 4a i q(tot) total quiescent current - 40 80 ma i stb standby current - 0.1 100 m a i sw(on) switch-on current -- 40 m a inputs ? z i ? input impedance btl 25 -- k w stereo 50 -- k w stereo application p o output power thd = 10% r l =4 w- 6 - w r l =2 w- 11 - w a cs channel separation 40 -- db v n(o)(rms) noise output voltage (rms value) - 150 -m v btl application p o output power thd = 10%; r l =4 w- 22 - w svrr supply voltage ripple rejection r s =0 w f = 100 hz 34 -- db f = 1 to 10 khz 48 -- db ?d v oo ? dc output offset voltage -- 250 mv t j junction temperature -- 150 c
2000 mar 08 4 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c block diagram fig.1 block diagram. mgl491 handbook, full pagewidth 60 k w input reference voltage power ground (substrate) + + - 5 signal ground 2 7 9 6 183 w 18.1 k w 3 tda1519c 15 k w 15 k w va va c m mute switch power stage 60 k w standby reference voltage mute reference voltage 1 ninv rr inv out2 m/ss out1 gnd1 gnd2 v p 4 8 183 w 18.1 k w va c m mute switch power stage + - mute switch standby switch 1 v p the pin numbers refer to the tda1519c and TDA1519CSP.
2000 mar 08 5 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c pinning symbol pin description tda1519c; TDA1519CSP tda1519ctd tda1519cth ninv 1 19 2 non-inverting input gnd1 2 20 1 ground 1 (signal) rr 3 1 20 supply voltage ripple rejection out1 4 3 18 output 1 gnd2 5 5 16 ground 2 (substrate) out2 6 8 13 output 2 v p 7 10 11 positive supply voltage m/ss 8 11 10 mute/standby switch input inv 9 12 9 inverting input n.c. - 2, 4, 6, 7, 9 and 13 to 18 3 to 8, 12, 14, 15, 17 and 19 not connected fig.2 pin configuration (sot131-2 and 354-1). h alfpage ninv gnd1 rr out1 gnd2 out2 v p m/ss inv 1 2 3 4 5 6 7 8 9 tda1519c TDA1519CSP mgr561 f page rr n.c. out1 n.c. gnd2 n.c. n.c. out2 n.c. v p gnd1 ninv n.c. n.c. n.c. n.c. n.c. n.c. inv m/ss 1 2 3 4 5 6 7 8 9 10 11 12 20 19 18 17 16 15 14 13 tda1519ctd mgl937 fig.3 pin configuration (sot397-1). f page gnd1 ninv n.c. n.c. n.c. n.c. n.c. n.c. inv m/ss rr n.c. out1 n.c. n.c. n.c. gnd2 out2 n.c. v p 1 2 3 4 5 6 7 8 9 10 11 12 20 19 18 17 16 15 14 13 tda1519cth mgl936 fig.4 pin configuration (sot418-2).
2000 mar 08 6 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c functional description the tda1519c contains two identical amplifiers with differential input stages. the gain of each amplifier is fixed at 40 db. a special feature of this device is the mute/standby switch which has the following features: low standby current (<100 m a) low mute/standby switching current (low cost supply switch) mute condition. limiting values in accordance with the absolute maximum rating system (iec 134). symbol parameter conditions min. max. unit v p supply voltage operating - 17.5 v non-operating - 30 v load dump protected; during 50 ms; t r 3 2.5 ms - 45 v v sc ac and dc short-circuit-safe voltage - 17.5 v v rp reverse polarity voltage - 6v energy handling capability at outputs v p =0v - 200 mj i osm non-repetitive peak output current - 6a i orm repetitive peak output current - 4a p tot total power dissipation see fig.5 - 25 w t j junction temperature - 150 c t stg storage temperature - 55 +150 c fig.5 power derating curve for sil9p. handbook, halfpage - 25 0 50 150 30 10 0 20 mgl492 100 p tot (w) t amb ( c) (1) (2) (3) (1) infinite heatsink. (2) r th(c-a) = 5 k/w. (3) r th(c-a) = 13 k/w.
2000 mar 08 7 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c thermal characteristics dc characteristics v p = 14.4 v; t amb =25 c; measurements taken using fig.6; unless otherwise speci?ed. notes 1. the circuit is dc adjusted at v p = 6 to 17.5 v and ac operating at v p = 8.5 to 17.5 v. 2. at v p = 17.5 to 30 v, the dc output voltage 0.5v p . symbol parameter conditions value unit r th(j-a) thermal resistance from junction to ambient in free air tda1519c 40 k/w tda1519cth and tda1519ctd 40 k/w r th(j-c) thermal resistance from junction to case tda1519c 3 k/w tda1519cth and tda1519ctd 3 k/w symbol parameter conditions min. typ. max. unit supplies v p supply voltage note 1 6.0 14.4 17.5 v i q(tot) total quiescent current - 40 80 ma v o dc output voltage note 2 - 6.95 - v ?d v oo ? dc output offset voltage -- 250 mv mute/standby switch v sw(on) switch-on voltage level 8.5 -- v mute condition v mute mute voltage 3.3 - 6.4 v v o output signal in mute position v i = 1 v (max.); f = 20 hz to 15 khz -- 20 mv ?d v oo ? dc output offset voltage -- 250 mv standby condition v stb standby voltage standby mode 0 - 2v i stb standby current standby mode -- 100 m a i sw(on) switch-on current - 12 40 m a
2000 mar 08 8 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c ac characteristics v p = 14.4 v; r l =4 w ; f = 1 khz; t amb =25 c; unless otherwise speci?ed. symbol parameter conditions min. typ. max. unit stereo application (see fig.6) p o output power note 1 thd = 0.5% 4 5 - w thd = 10% 5.5 6.0 - w r l =2 w ; note 1 thd = 0.5% 7.5 8.5 - w thd = 10% 10 11 - w thd total harmonic distortion p o =1w - 0.1 - % f ro(l) low frequency roll-off - 3 db; note 2 - 45 - hz f ro(h) high frequency roll-off - 1db 20 -- khz g v(cl) closed-loop voltage gain 39 40 41 db svrr supply voltage ripple rejection on; notes 3 and 4 40 -- db on; notes 3 and 5 45 -- db mute; notes 3 and 6 45 -- db standby; notes 3 and 6 80 -- db ? z i ? input impedance 50 60 75 k w v n(o)(rms) noise output voltage (rms value) note 7 on; r s =0 w- 150 -m v on; r s =10k w- 250 500 m v mute; note 8 - 120 -m v a cs channel separation r s =10k w 40 -- db ?d g v(ub) ? channel unbalance - 0.1 1 db btl application (see fig.7) p o output power note 1 thd = 0.5% 15 17 - w thd = 10% 20 22 - w output power at v p = 13.2 v note 1 thd = 0.5% - 13 - w thd = 10% - 17.5 - w thd total harmonic distortion p o =1w - 0.1 - % b p power bandwidth thd = 0.5%; p o = - 1 db; with respect to 15 w - 35 to 15000 - hz f ro(l) low frequency roll-off - 1 db; note 2 - 45 - hz f ro(h) high frequency roll-off - 1db 20 -- khz g v(cl) closed-loop voltage gain 45 46 47 db
2000 mar 08 9 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c notes 1. output power is measured directly at the output pins of the ic. 2. frequency response externally fixed. 3. ripple rejection measured at the output with a source impedance of 0 w (maximum ripple amplitude of 2 v). 4. frequency f = 100 hz. 5. frequency between 1 and 10 khz. 6. frequency between 100 hz and 10 khz. 7. noise voltage measured in a bandwidth of 20 hz to 20 khz. 8. noise output voltage independent of r s (v i = 0 v). svrr supply voltage ripple rejection on; notes 3 and 4 34 -- db on; notes 3 and 5 48 -- db mute; notes 3 and 6 48 -- db standby; notes 3 and 6 80 -- db ? z i ? input impedance 25 30 38 k w v n(o)(rms) noise output voltage (rms value) note 7 on; r s =0 w- 200 -m v on; r s =10k w- 350 700 m v mute; note 8 - 180 -m v symbol parameter conditions min. typ. max. unit
2000 mar 08 10 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c application information fig.6 stereo application diagram (sot131-2 and sot354-1). handbook, full pagewidth 2200 m f 1000 m f 100 m f 100 nf 220 nf 60 k w input reference voltage 40 db + - 1 220 nf 60 k w 40 db - + 9 546 inverting input non-inverting input internal 1/2 v p v p power ground 2 signal ground tda1519c 38 7 standby switch mgl493 fig.7 btl application diagram (sot131-2 and sot354-1). handbook, full pagewidth 2200 m f 100 nf 220 nf 60 k w r l = 4 w input reference voltage 40 db + - 1 60 k w 40 db - + 9 546 non-inverting input to pin 9 internal 1/2 v p v p power ground 2 signal ground tda1519c 38 7 standby switch mgl494 to pin 1
2000 mar 08 11 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c fig.8 total quiescent current (i q(tot) ) as a function of supply voltage (v p ). handbook, halfpage 020 60 30 40 50 mgr539 4 8 12 16 i q(tot) (ma) v p (v) fig.9 output power (p o ) as a function of supply voltage (v p ) for btl application at r l = 4 w ; f = 1 khz. handbook, halfpage 020 30 0 10 20 mgr540 4 8 12 16 p o (w) v p (v) thd = 10% 0.5%
2000 mar 08 12 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c fig.10 total harmonic distortion (thd) as a function of output power (p o ) for btl application at r l =4 w ; f = 1 khz. handbook, halfpage 12 0 10 - 1 11010 2 mgr541 4 8 thd (%) p o (w) fig.11 total harmonic distortion (thd) as a function of operating frequency (f) for btl application at r l =4 w ; p o =1w. handbook, halfpage 0.6 0 10 10 2 10 3 10 4 mgr542 0.2 0.4 thd (%) f (hz)
2000 mar 08 13 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c package outlines unit a b max. b p 2 cd (1) e (1) z (1) de d h l j references outline version european projection issue date iec jedec eiaj mm 4.6 4.4 1.1 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 2.54 12.2 11.8 3.4 3.1 a max. 1 2.0 e h 6 2.00 1.45 2.1 1.8 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 17.2 16.5 sot131-2 95-03-11 99-12-17 0 5 10 mm scale q 0.25 w 0.03 x d l a e c a 2 q w m b p d d z e x h 19 e h non-concave seating plane 1 b j sil9p: plastic single in-line power package; 9 leads sot131-2 view b : mounting base side b
2000 mar 08 14 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c unit a a 1 a 2 a 3 b p cd (1) e (1) z (1) de d h e h l p l references outline version european projection issue date iec jedec eiaj mm 4.9 4.2 0.35 0.05 4.6 4.4 0.25 0.75 0.60 24.0 23.6 0.48 0.38 10 20.0 19.6 12.2 11.8 2.54 3.4 2.8 2.1 1.9 6 3 0 2.00 1.45 3.4 3.1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 7.4 6.6 sot354-1 0 5 10 mm scale q j 0.15 wx y q d c a 1 q heatsink heatsink q a l p (a 3 ) a 2 0.03 0.25 w m b p d d h z e x 91 j e h non-concave 98-10-08 99-12-17 sms9p: plastic surface mounted single in-line power package; 9 leads sot354-1 l e y
2000 mar 08 15 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c unit a 4 (1) references outline version european projection issue date 98-02-25 99-11-12 iec jedec eiaj mm + 0.12 - 0.02 3.5 0.35 dimensions (mm are the original dimensions) notes 1. limits per individual lead. 2. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot418-2 0 5 10 mm scale hsop20: plastic, heatsink small outline package; 20 leads; low stand-off height sot418-2 a max. detail x a 2 3.5 3.2 d 2 1.1 0.9 h e 14.5 13.9 l p 1.1 0.8 q 1.7 1.5 2.5 2.0 v 0.25 w 0.25 yz 8 0 q 0.07 x 0.03 d 1 13.0 12.6 e 1 6.2 5.8 e 2 2.9 2.5 b p c 0.32 0.23 e 1.27 d (2) 16.0 15.8 e (2) 11.1 10.9 0.53 0.40 a 3 a 4 a 2 (a 3 ) l p q a q d y x h e e c v m a x a b p w m z d 1 d 2 e 2 e 1 e 20 11 1 10 pin 1 index
2000 mar 08 16 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c unit a 1 references outline version european projection issue date 97-11-03 99-11-12 iec jedec eiaj mm 0.3 0.1 3.6 0.35 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot397-1 0 5 10 mm scale hsop20: plastic, heatsink small outline package; 20 leads sot397-1 a max. d y h e a 1 a 4 a 2 b p (a 3 ) e c v m a x a l p detail x q a q w m z d 1 d 2 e 2 e 1 e 1 10 20 11 pin 1 index a 2 3.3 3.0 a 4 0.1 0 d 2 1.1 0.9 h e 14.5 13.9 l p 1.1 0.8 q 1.5 1.4 2.5 2.0 v 0.25 w 0.25 yz 8 0 q 0.1 d 1 13.0 12.6 e 1 6.2 5.8 e 2 2.9 2.5 b p c 0.32 0.23 e 1.27 d (1) 16.0 15.8 e (1) 11.1 10.9 0.53 0.40 a 3
2000 mar 08 17 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c soldering introduction this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mount ics, or for printed-circuit boards with high population densities. in these situations reflow soldering is often used. through-hole mount packages s oldering by dipping or by solder wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joints for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg(max) ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. m anual soldering apply the soldering iron (24 v or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. surface mount packages r eflow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 230 c. w ave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. m anual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
2000 mar 08 18 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c suitability of ic packages for wave, re?ow and dipping soldering methods notes 1. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 2. for sdip packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. these packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 5. wave soldering is only suitable for lqfp, qfp and tqfp packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. mounting package soldering method wave reflow (1) dipping through-hole mount dbs, dip, hdip, sdip, sil suitable (2) - suitable surface mount bga, lfbga, sqfp, tfbga not suitable suitable - hbcc, hlqfp, hsqfp, hsop, htqfp, htssop, sms not suitable (3) suitable - plcc (4) , so, soj suitable suitable - lqfp, qfp, tqfp not recommended (4)(5) suitable - ssop, tssop, vso not recommended (6) suitable - data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation.
2000 mar 08 19 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c notes
? philips electronics n.v. sca all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. internet: http://www.semiconductors.philips.com 2000 69 philips semiconductors C a worldwide company for all other countries apply to: philips semiconductors, international marketing & sales communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 3 figtree drive, homebush, nsw 2140, tel. +61 2 9704 8141, fax. +61 2 9704 8139 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101 1248, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 20 0733, fax. +375 172 20 0773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 68 9211, fax. +359 2 68 9102 canada: philips semiconductors/components, tel. +1 800 234 7381, fax. +1 800 943 0087 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: sydhavnsgade 23, 1780 copenhagen v, tel. +45 33 29 3333, fax. +45 33 29 3905 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615 800, fax. +358 9 6158 0920 france: 51 rue carnot, bp317, 92156 suresnes cedex, tel. +33 1 4099 6161, fax. +33 1 4099 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 2353 60, fax. +49 40 2353 6300 hungary: see austria india: philips india ltd, band box building, 2nd floor, 254-d, dr. annie besant road, worli, mumbai 400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: pt philips development corporation, semiconductors division, gedung philips, jl. buncit raya kav.99-100, jakarta 12510, tel. +62 21 794 0040 ext. 2501, fax. +62 21 794 0080 ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, via casati, 23 - 20052 monza (mi), tel. +39 039 203 6838, fax +39 039 203 6800 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108-8507, tel. +81 3 3740 5130, fax. +81 3 3740 5057 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381, fax +9-5 800 943 0087 middle east: see italy netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 pakistan: see singapore philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland : al.jerozolimskie 195 b, 02-222 warsaw, tel. +48 22 5710 000, fax. +48 22 5710 001 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 319762, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 58088 newville 2114, tel. +27 11 471 5401, fax. +27 11 471 5398 south america: al. vicente pinzon, 173, 6th floor, 04547-130 s?o paulo, sp, brazil, tel. +55 11 821 2333, fax. +55 11 821 2382 spain: balmes 22, 08007 barcelona, tel. +34 93 301 6312, fax. +34 93 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 5985 2000, fax. +46 8 5985 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2741 fax. +41 1 488 3263 taiwan: philips semiconductors, 6f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2886, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, tel. +66 2 745 4090, fax. +66 2 398 0793 turkey: yukari dudullu, org. san. blg., 2.cad. nr. 28 81260 umraniye, istanbul, tel. +90 216 522 1500, fax. +90 216 522 1813 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 208 730 5000, fax. +44 208 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381, fax. +1 800 943 0087 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 3341 299, fax.+381 11 3342 553 printed in the netherlands 753503/02/pp 20 date of release: 2000 mar 08 document order number: 9397 750 06633

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